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3D打印的技術(shù)分類
1、SLA（StereoLithography，光固化成型技術(shù)）
指利用紫外光照射液態(tài)光敏樹脂發(fā)生聚合反應(yīng)，逐層固化并生成三維實(shí)體。SLA制造的工件尺寸精度高，是商業(yè)化較早的3D打印技術(shù)。
2、CLIP（ContinuousLiquid Interface Production Technology，連續(xù)液體界面提取技術(shù)）
是Carbon 3D公司在SLA技術(shù)的基礎(chǔ)上開發(fā)的具有革命性的3D打印技術(shù)，將3D打印的速度提高了100倍。CLIP從底部投影，使光敏樹脂固化，未固化的部分通過(guò)控制氧氣形成死區(qū)，抑制光固化反應(yīng)而保持穩(wěn)定的液態(tài)區(qū)域，保證了固化的連續(xù)性。
3、3DP（Three-DimensionalPrinting，三維打印快速成型技術(shù)）
與傳統(tǒng)二維噴墨打印接近，從噴頭噴出粘結(jié)劑（彩色粘結(jié)劑可以打印出彩色制件），將平臺(tái)上的粉末粘結(jié)成型，通常采用石膏粉作為成型材料。3DP技術(shù)目前主要有兩項(xiàng)應(yīng)用：全彩3D打印和砂模鑄造。
4、PJ（Poly Jet，聚合物噴射技術(shù)）
其成型原理類似3DP技術(shù)，但噴射的不是粘合劑而是光固化樹脂，噴射完成后通過(guò)紫外光照射固化成型。Poly Jet采用陣列式噴頭，甚至可以同時(shí)噴射不同材料，實(shí)現(xiàn)多種材料、多色材料同時(shí)打印。
5、FDM（FusedDeb Modeling，熔融層積技術(shù)）
利用高溫將材料熔化，通過(guò)打印頭擠出成細(xì)絲，在構(gòu)件平臺(tái)上堆積成型。FDM是最簡(jiǎn)單也是最常見(jiàn)的3D打印技術(shù)，通常應(yīng)用于桌面級(jí)3D打印設(shè)備。
6、NPJ（NanoParticle Jetting，納米顆粒噴射打印技術(shù)）
這是金屬3D打印成型技術(shù)，使用納米液態(tài)金屬以噴墨的方式沉積成型，打印速度比普通激光打印快5倍，且具有優(yōu)異的精度和表面粗糙度。
7、SLM（SelectiveLaser Melting，選區(qū)激光熔化成型技術(shù)）
是目前金屬3D打印成型中最普遍應(yīng)用的技術(shù)，采用精細(xì)聚焦光斑快速熔化預(yù)置金屬粉末，直接獲得任意形狀以及具有完全冶金結(jié)合的零件，制件致密度可達(dá)99%以上。
8、SLS（SelectiveLaser Sintering，選區(qū)激光燒結(jié)成型技術(shù)）
與SLM技術(shù)類似，區(qū)別是激光功率不同，通常用于高分子聚合物的3D打印成型。SLS也可用于制造金屬或陶瓷零件，制件致密度低，且需要經(jīng)過(guò)后期致密化處理才能使用。
9、LMD（LaserMetal Deb，激光熔覆成型技術(shù)）
該技術(shù)名稱繁多，常用名稱包括：LENS、DMD、DLF、LRF等。與SLM最大不同在于，其粉末通過(guò)噴嘴聚集到工作臺(tái)面，與激光匯于一點(diǎn)，粉末熔化冷卻后獲得堆積的熔覆實(shí)體。
10、EBM（ElectronBeam Melting，電子束熔化技術(shù)）
其工藝過(guò)程與SLM非常相似，區(qū)別在于，EBM所使用的能量源為電子束。EBM的電子束輸出能量通常比SLM的激光輸出功率大一個(gè)數(shù)量級(jí)，掃描速度也遠(yuǎn)高于SLM。因此EBM在構(gòu)建過(guò)程中，需要對(duì)造型臺(tái)整體進(jìn)行預(yù)熱，防止成型過(guò)程中溫度過(guò)大帶來(lái)較大的殘余應(yīng)力。
 

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IC693CPU363 CPU 363 Module (240K Bytes configurable user memory)

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150-C361NBR SMC-3 361A Smart Motor Controller

1609-NMC 1609 UPS Accessory

1771-CD 1771-P2 Power Supply Cable

193-EC1PB E3 0.4-2.0 A Overload Relay

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2090-CPBM7E7-14AF15 MP-Series 15 m Length Cable

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CP9I-0MEB-0070-AZ Alpha 50HVis shielded motor power cable (7 meter)

GFK-0263 Logicmaster 90-70 Programming Software User's Manual

IC200UEX213 28 point expansion. (16) 12VDC In, (12) Relay Out, 12VDC Power Supply (included IC200CBL501)

IC647ANS001 PA new SFL allows 1 Production Unit in PA plant model to use 1 of the 11 server functions

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IC800SLT004 SL Amplifier Breakout Terminal Block for Third Party Controller Interface

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Operator Interface 2711P-B15C6B2 PV PLUS 1500, KEY/TOUCH, RIO/DH, AC PS, EXT MEM

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Motion Control 8720MC-MCM SPARE MAIN CONTROL MODULE KIT

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IC300RCS210 Remote Control Station (OCS without Keypad and display) Supports up to 4 SmartStack I/O Boards, full ladder instruction set, and CsCAN Networking.

IC754VKB06MTD Starter Kit - 6" Monochrome QuickPanel View Basic, Touch, 24VDC

MTR-3T55-I-R-B-M-0RR Servo Motor Metric 24V Brake

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20DC030A3NYNACGNE PowerFlex 700S AC Drive 20D

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IC647HSTSC50KM Server to Server Collector for Historian - Standard Server 50000 Points (M4 Key)

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"

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Motion Control F-4075-R-H00AN MOTOR,F-,NEMA 56C,82 IN LB CONT.

4362-H 4362 WITH 0-10 OR 4-20 mA OUTPUT

IC200ACC404 Spare parts kit. Two terminal strips and four plastic doors and four covers

IC693DSM314 Series 90-30 DSM314 Motion Controller, 1-4 axis

TGT-S000-1-1 Target System Module with 2 MB RAM

VDOCS-OFF5 VisualDocs Office (5) seats

20BD022A0AYNACD0 PowerFlex 700 AC Drive 22 A at 15 Hp 20B

20G11FC022AA0NNNNN PowerFlex 755 AC Packaged Drive

22C-D010N103 PowerFlex 400- 4 kW (5 HP) AC Drive

140CRP93200 Quantum RIO 處理器接口, S908 Head, 雙電纜，本地（總站）

285-BRC25-M12D Source Brake Patchcord Cable, 12M, M25

計(jì)數(shù):0-999999c,計(jì)數(shù)速度:1Kcps,計(jì)時(shí)時(shí)間:0.00s-99999.9h

1492-SPM1D150 MCB Supplementary Protector 15 A

通用型變頻器 6SE6 440-2UD31-5DB1 "15 KW,275 x 520 x 245"

電機(jī)啟動(dòng)器 3VU13403MS00

150-C480NCD SMC-3 480A Smart Motor Controller

1609-SPD UPS Surge Replacement Module

1771-IC DC INPUT 48V

193-EC3CB E3 Plus 5-25 A Overload Relay