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AFG310現(xiàn)貨 in stock! 歡迎來(lái)電咨詢(xún)~��！

AFG310,

AFG310

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3D打印的技術(shù)分類(lèi)
1、SLA（StereoLithography，光固化成型技術(shù)）
指利用紫外光照射液態(tài)光敏樹(shù)脂發(fā)生聚合反應(yīng)，逐層固化并生成三維實(shí)體。SLA制造的工件尺寸精度高，是商業(yè)化較早的3D打印技術(shù)。
2、CLIP（ContinuousLiquid Interface Production Technology，連續(xù)液體界面提取技術(shù)）
是Carbon 3D公司在SLA技術(shù)的基礎(chǔ)上開(kāi)發(fā)的具有革命性的3D打印技術(shù)，將3D打印的速度提高了100倍。CLIP從底部投影，使光敏樹(shù)脂固化，未固化的部分通過(guò)控制氧氣形成死區(qū)，抑制光固化反應(yīng)而保持穩(wěn)定的液態(tài)區(qū)域，保證了固化的連續(xù)性。
3、3DP（Three-DimensionalPrinting，三維打印快速成型技術(shù)）
與傳統(tǒng)二維噴墨打印接近，從噴頭噴出粘結(jié)劑（彩色粘結(jié)劑可以打印出彩色制件），將平臺(tái)上的粉末粘結(jié)成型，通常采用石膏粉作為成型材料。3DP技術(shù)目前主要有兩項(xiàng)應(yīng)用：全彩3D打印和砂模鑄造。
4、PJ（Poly Jet，聚合物噴射技術(shù)）
其成型原理類(lèi)似3DP技術(shù)，但噴射的不是粘合劑而是光固化樹(shù)脂，噴射完成后通過(guò)紫外光照射固化成型。Poly Jet采用陣列式噴頭，甚至可以同時(shí)噴射不同材料，實(shí)現(xiàn)多種材料、多色材料同時(shí)打印。
5、FDM（FusedDeb Modeling，熔融層積技術(shù)）
利用高溫將材料熔化，通過(guò)打印頭擠出成細(xì)絲，在構(gòu)件平臺(tái)上堆積成型。FDM是最簡(jiǎn)單也是最常見(jiàn)的3D打印技術(shù)，通常應(yīng)用于桌面級(jí)3D打印設(shè)備。
6、NPJ（NanoParticle Jetting，納米顆粒噴射打印技術(shù)）
這是金屬3D打印成型技術(shù)，使用納米液態(tài)金屬以噴墨的方式沉積成型，打印速度比普通激光打印快5倍，且具有優(yōu)異的精度和表面粗糙度。
7、SLM（SelectiveLaser Melting，選區(qū)激光熔化成型技術(shù)）
是目前金屬3D打印成型中最普遍應(yīng)用的技術(shù)，采用精細(xì)聚焦光斑快速熔化預(yù)置金屬粉末，直接獲得任意形狀以及具有完全冶金結(jié)合的零件，制件致密度可達(dá)99%以上。
8、SLS（SelectiveLaser Sintering，選區(qū)激光燒結(jié)成型技術(shù)）
與SLM技術(shù)類(lèi)似，區(qū)別是激光功率不同，通常用于高分子聚合物的3D打印成型。SLS也可用于制造金屬或陶瓷零件，制件致密度低，且需要經(jīng)過(guò)后期致密化處理才能使用。
9、LMD（LaserMetal Deb，激光熔覆成型技術(shù)）
該技術(shù)名稱(chēng)繁多，常用名稱(chēng)包括：LENS、DMD、DLF、LRF等。與SLM最大不同在于，其粉末通過(guò)噴嘴聚集到工作臺(tái)面，與激光匯于一點(diǎn)，粉末熔化冷卻后獲得堆積的熔覆實(shí)體。
10、EBM（ElectronBeam Melting，電子束熔化技術(shù)）
其工藝過(guò)程與SLM非常相似，區(qū)別在于，EBM所使用的能量源為電子束。EBM的電子束輸出能量通常比SLM的激光輸出功率大一個(gè)數(shù)量級(jí)，掃描速度也遠(yuǎn)高于SLM。因此EBM在構(gòu)建過(guò)程中，需要對(duì)造型臺(tái)整體進(jìn)行預(yù)熱，防止成型過(guò)程中溫度過(guò)大帶來(lái)較大的殘余應(yīng)力。
 

194L-E12-3253 12A 194L Load Switch

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GFK-1062 Series 90-70 High Speed Counter User's Manual

IC646MDD000 Logic Developer PC w/Runtime (HRT) 8,000 I/O

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meteor_II M2/4B 750-03

S5207G2NR-EFI

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1492-PBC9 Power Distribution Block Accessory

中央機(jī)架 6ES7400-2JA00-0AA0 UR2-H 機(jī)架用于分段的中央機(jī)架，18 槽

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1585J-M8PBJM-50 RJ45 Ethernet Media

1760-MM2 Pico 18 Point Memory Module

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IC670MDL643RR 5/12Vdc Pos/Neg Logic Input 16 pt. Grouped

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IC800SLCIZ010 Interface cable to connect any 30 Watt to 750 Watt SL series amplifier to terminal block. 1 meter

ControlLogix/1756 System 1756-DHRIO DH+/RIO BRIDGE/SCANNER MODULE

Industrial Computers 6182H-12TEH4B VVCE 1250, TOUCH, EXT MEM, ENET, AC

Process Control 1757-PFBUL100 PROFIBUS INTERFACE MODULE USAGE LICENSE

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PXI-2544

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BC646MDA159 View Development/Runtime 1500 I/O with Proficy GlobalCare Complete

GC647ACN001 GC Enterprise Connector

HMI-CAB-C120 CABLE GE FANUC 90/30 CPU, RJ11 11 Serial Port

IC641SWP042 Series 90 Protocol (SNP) Driver, DOS, Multi-Use License

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IC660EBA105 Electronic Assembly for IC660BBA105

IC695PSA140 120/240VAC, 125VDC Multipurpose Power Supply is suitable for use in load -sharing and redundancy application. It must be installed in a PACsystems RX3i (IC695catalog number) Universal Backplane. It can be used as the only power supply in the backplan

IC756WRE049K-99 DataViews Runtime for Windows 25-49, Per User, Korean, Version 9.9

FlexLogix System 1794-OA8 85-132 VAC OUTPUT MODULE, 8 POINT

PLC-5/1771 System D1785-6.5.12 PLC5 ETHERNET PROGRAMMABLE CONTROLERS USERS MANUAL

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電機(jī)啟動(dòng)器 3VU16403CR00

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G-0001-A 6 Foot Gage Extension Cable

GFK-2079 PMC IDE Hard Disk Adapter User's Manual

IC220PWR003 POWER TERMINAL, FUSED W/DIAG 24VDC (REQUIRES 1 IC220TBK087)

IC647DNP000 DNP3 Master Protocol for Unlimited points

IC647ROC050M ROC:Fisher Remote Operations Controller for 250 Units

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