端子1769-IF8
.功能與參數(shù)測試
1.<測試儀>對器件的檢測,僅能反應出截止區(qū),放大區(qū)和飽和區(qū).但不
能測出工作頻率的高低和速度的快慢等具體數(shù)值等.
2.同理對TTL數(shù)字芯片而言,也只能知道有高低電平的輸出變化.而無
法查出它的上升與下降沿的速度.
四.晶體振蕩器
1.通常只能用示波器(晶振需加電)或頻率計測試,萬用表等無法測量,
否則只能采用代換法了.
2.晶振常見故障有:a.內(nèi)部漏電,b.內(nèi)部開路c.變質(zhì)頻偏d.外圍相連電
容漏電.這里漏電現(xiàn)象,用<測試儀>的VI曲線應能測出.
3.整板測試時可采用兩種判斷方法:a.測試時晶振附近既周圍的有關(guān)
芯片不通過.b.除晶振外沒找到其它故障點.
4.晶振常見有2種:a.兩腳.b.四腳,其中第2腳是加電源的,注意不可隨
意短路.
五.故障現(xiàn)象的分布
1.電路板故障部位的不完全統(tǒng)計:1)芯片損壞30%, 2)分立元件損壞30%,
3)連線(PCB板敷銅線)斷裂30%, 4)程序破壞或丟失10%(有上升趨勢).
2.由上可知,當待修電路板出現(xiàn)聯(lián)線和程序有問題時,又沒有好板子,既
不熟悉它的連線,找不到原程序.此板修好的可能性就不大了.
端子1769-IF8
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